Laser PCB Depaneling – On What Exactly Justification Should You Really Come To A Decision..

Micron Laser Technology provides PCB Depanelizer and part excising services for consumer products, original equipment manufacturers, and printed circuit board manufacturers. MLT’s numerous laser machining centers are geared up to deal with volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a mixture of both.

Depending on the material as well as the part requirements, MLT offers a tool-less part removal process in the form of final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the benefit of speed, positional accuracy, no tooling cost or wear, no part induced stresses, without any cutting oils or other contaminants.

Hold-in Tabs

Hold-in tabs are small uncut sections concerning the part used to secure the part in the panel. The hold-in tabs can be used as easy of handling small parts or part securement for additional processing. The hold-in tab width is chosen based on the level of force desired to removed the part from your panel/sheet or known forces to become applied by downstream processes like component loading or electro-polish. MLT can create tabs in many any material as well as any width and location concerning the part.

Scoring

Laser scoring generates a limited depth ablation line within the part or material set. The depth is usually 50% in the material thickness but may be controlled to a desired depth. The scoring acts just like the hold-tab to secure the part in the panel or sheet, but allows for individual parts to get ‘snapped’ out. Laser scoring lines could also be used as being a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into shape without expensive forming dies.

Perforations

Much like scoring or v-grooves, laser perforations are another option for tool-less part removal from the panel or sheet. Perforations can be laser formed to any size and spacing to meet the desired removal and Motorized PCB Depanelizer. Depending on the material and the part requirements, BEST laser services supplies a tool-less part removal process by means of final perforation, scoring and hold-in tabs. Using a laser to execute the depaneling affords the user the benefit of speed and positional accuracy. Unlike mechanical methods there is not any part induced stresses, no tooling cost without any cutting oils or some other contaminants.

Laser depaneling is perfect for rigid-flex boards as it provides a precise method to cut through a variety of materials including but not restricted to the following most common materials seen:

Combinations thereof, appropriate for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST could be that provider of laser depanelization when you have lots of IoT devices which lmuteg to become precisely machined or cut out to fit perfectly directly into small mechanical enclosures.

As a result of contact-free processing that goes on with laser depanelization of printed circuit boards, there is very little distortion even though thin materials are utilized. When boards are milled or punched out using a mechanical tool there might prove to be a loss precision and potentially a distortion in the outside board dimensions. Even worse it may crack solder joints when you use these mechanical means. In BEST laser depanelization system feature fiducial registration and internet based scaling, which suggests already existing distortions could be compensated and the cut contours positioned precisely within the layout.

The methods for straight line PCB Laser Depaneling, that are setup for rectangular-shaped PCBs, all cut or crush the advantage in the board edge. These techniques include die cutting, punching or V-scoring the assembly or by using a wheel cutter or a saw. The sawing method typically works with a single rotating blade spinning at high RPM to slice the panel to the shapes required. This method produces heat in the eliminate area as

well as creating debris as being a byproduct from the cutting operation. In V-scoring the depth from the thickness in the board is 30-40% in the original board thickness because it is cut from both sides of the board. After assembly the board is broken around this v-score line. Alternately a “pizza cutter” cuts through the V-score of the panel and cuts the rest of the web till the boards have been in their final cutout shape thereby putting strain on the components and solder joints-especially those near the board edge. In another method, the singulated board outline can be punched out make up the panel. This involves which a new punch be applied for every single kind of circuit board which means it is far from an adaptable method of board eliminate. The punch force could also bend or deform the edges in the PCB.